| H2 | DFA | Module | Status |
| 47 | 3F5 | 1 | M03-04 |
| 50 | 3B5 | 1 | M03-04 |
| 42 | 3B7 | 2 | M03-05 |
| 39 | 3F4 | 2 | M03-05 |
| 43 | 3F3 | 3 | M03-06 |
| 41 | 3B12 | 3 | M03-06 |
| 40 | 3F8 | 4 | M03-07 |
| 37 | 3B8 | 4 | M03-07 |
| 46 | 3F7 | 5 | M03-08 |
| 48 | 3B6 | 5 | M03-08 |
| 34 | 3F9 | 6 | M03-09 |
| 33 | 3B14 | 6 | M03-09 |
| 49 | 3F6 | 7 | blobbed bonds: testing |
| 35 | 3B3 | 7 | scratched chip; ready for gluing |
| 45 | 3F2? | test? | received |
| 31 | 3B11? | test? | blobbed bonds; loose Berg? High current |
| 3B10 | high current |