| H1 | size | DFA | Sextant | Status |
| 8 | 2B9 | 1 | SX-04 | |
| 30 | 2F7 | 1 | SX-04 | |
| 37 | 1F5 | 1 | SX-04 | |
| 76 | 1B9 | 1 | SX-04 | |
| 80 | 2B10 | 2 | SX-05 | |
| 81 | 1B7 | 2 | SX-05 | |
| 72 | 2F11 | 2 | SX-05 | |
| 69 | 1F10 | 2 | SX-05 | |
| 82 | 1B8 | 3 | SX-06 | |
| 78 | 2B12 | 3 | SX-06 | |
| 65 | thick | 1F9 | 3 | SX-06 |
| 60 | 2F6 | 3 | SX-06 | |
| 77 | ok- | 2B11 | 4 | SX-07 |
| 83 | ok | 1B10 | 4 | SX-07 |
| 70 | ok- | 1F8 | 4 | SX-07 |
| 64 | thin | 2F10 | 4 | SX-07 |
| 63 | ok | 1F7 | 5 | SX-08 |
| 74 | thick | 1B4 | 5 | SX-08 |
| 73 | thin | 2B5 | 5 | SX-08 |
| 61 | thin | 2F5 | 5 | SX-08 |
| 62 | thin | 2F9 | 6 | SX-09 |
| 49 | ok | 1F3 | 6 | SX-09 |
| 75 | very thin | 2B15 | 6 | SX-09 |
| 14 | thick | 1B13 | 6 | SX-09 |
| 21 | thin | 1B12 (b1) | 7 | awaiting final DFA work |
| 66 | very thin | 2Fx | 7 | blobbed bonds; HDI testing |
| 68 | 1F11 | 7 | HDI testing | |
| 27 | thin | 2B4 | 7 | blobbed bonds; HDI testing |
| 31 | ok | 1B11 | test | ready for assembly; old spacers |
| 71 | thin | 2F12 | test | ready for assembly; hard-to-bond chips |
| 18 | 1B6 (b1) | test | testing; back from Italy - chip replaced | |
| 28 | right | ? | test? | to Italy twice; awaiting sexing |
| 67 | F | x | returned to Italy; "dead" | |
| 79 | B | x | returned to Italy; "dead" | |
| 33 | F | ? | Berg connector problem | |
| 2B13 | high current | |||
| 1F2 | type B; bonded | |||
| 2B3 | type B; bonded | |||
| 1B3 | type B; bonded |