Test Beam Module Spreadsheet Description

Definitions

Global Channel	Channel number from 0 to 14*128-1. Global channel 0 is on the phi side, chip 0, channel 0.
Chip	Chip number from 0 to 13. 0-6 are on the phi side. 7-13 are on the z side (Chip 7 is elctronics address 0 on the z side).
Channel	Channel number from 0-127 on the chip.
Side	Phi (n) or Z (p) side of silicon.
Silicon Strip	Strip number on the silicon. Numbering starts from 1, not 0. On the z side, strips 1-441 are on wafer 1 (wafer closest to HDI) and strips 442-882 are on wafer 2.
DFA Fault	Code for the fault type from DFA testing (see below).
Bonding	Code for wire bonding (see below).
HDI Fault, Unbonded	Code for HDI faults found before wirebonding.
HDI Fault, Bonded	Code for HDI faults found after bonding.
Gains, Unbonded	Channel gains in mV/fC measured before bonding to DFA.
Intercepts, Unbonded	Channel intercepts in mV measured before bonding to DFA.
Gains, Bonded	Channel gains in mV/fC measured after bonding to DFA.
Intercepts, Bonded	Channel gains in mV measured after bonding to DFA.
Noise (counts)	Channel noise, measured after bonding, in units of threshold DAC counts.
Noise (electrons)	Channel noise, measured after bonding, in units of ENC. This is just Noise(counts)62504.29/(Gain, Bonded)

DFA Fault Codes

1	Pinhole
2	Short between readout strips
3	Short between readout strip and floating strip
4	Short to p-stop
5	Open on Upilex
6	Broken metal on Silicon
666	Unknown DFA

Bonding Codes

1	No Bond, Silicon-Silicon
2	No Bond, Silicon-Upilex
3	No Bond, Upilex-HDI
4	No Bond, plucked for study after gain and noise measurement

HDI Fault Codes

1	Dead Channel
2	Noisy Channel
3	Inefficient Channel
4	Digital Problem(turns on even when masked off)
5	Stuck On
777	Flaky, unknown problem

For an explanation of how the gains, offsets and noise are measured, see http://www.hep.ucsb.edu/BaBar/gains.html. In the spreadsheet we use channel-by-channel gains rather than an average value.

Note: A problem developed on Chip 6 between the unbonded and bonded tests. It is now effectively dead. Also, the extraction of gains and offset for chips 3 and 11 could be suspect due to intermittent problems. See http://www.hep.ucsb.edu/BaBar/TestBeamHints.html.